wafer production line
SP4-Wafer sheet collecting machine
If there is any trouble occurred on cream spreading machine or cooling tower, this machine will collect the eligible wafers automatically after receives the order from PLC, and the collected wafers can be reused after the trouble is resolved.
a. The rack is stainless steel and the holders are channel carbon steel with silver painting.
b. All the parts contacting the food are from SUS304 stainless steel and food-grade PU belt.
c. The broken wafer sheets can be collected once indicated.
d. The wafer sheets will be blocked if there is problem for cream spreading machine.
a. Dimension: 2000X700X760mm.
b. Power: 0. 18Kw，380v/3Phase /50Hz
Wafer biscuit production line:
Equipment & process of wafer biscuit machine:
Wafer biscuit production line
Production process of wafer biscuit production line:
batter mixing----wafer baking----cooling----cream spreading----book cooling----cutting
Equipments of wafer biscuit production line: 1.batter mixer 2.oven 3.connecting machine 4.vertical type cooler 5.collecting machine 6.cream spreader 7.wafer conveyor 8.wafer cutter 9.cream mixer 10.wafer smashing machine.
The oven has 27(-33-39-45-51-65-69-75) plates and they made of nodular cast iron, the standard dimension of baking plate is 470*325mm. The power transistor and travelling wheel have the Chinese patent, the line have PID temperature automatic control system and the good affect for wafer sheet.
Batter mixer is made of Stainless Steel. It can mixing 65kg batter with 25kg flour and 40kg water within 5 minutes.
Vertical type wafer cooler is made of Stainless Steel and using the own motor.
The racks of cream spreader are the stainless steel tank, the motor and pneumatic component which both seal in the tank have good waterproof and dustproof. The spreader has the easy clear design.
Wafer cooling tower is made of Stainless Steel, and the part which touch the wafer book are all made of Stainless Steel 304. The cooling fan is outlay and the temperature of cooler’s inlet air are 5C. The relative humidity of cooling tower is 55%.
Wafer cutter is mechanically and the maximum speed of cutting wafer book(filled with cream) are 8 books.